| | Liste des Conférences - Électronique 2014 2015 | |
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albatross
Messages : 1618 Points : 4124
| Sujet: Liste des Conférences - Électronique 2014 2015 Sam 13 Sep 2014 - 7:37 | |
| INTELEC 2014 — 2014 IEEE International Telecommunications Energy Conference Dates 28 Sep 2014 → 02 Oct 2014 [ID=573410] Haut de la page Lieu Vancouver, BC, Canada Résumé An international conference for users, designers, and manufacturers of communications energy systems for: Wireline and Wireless systems, Data/Internet systems, Video systems, SATCOM, CATV, VOIP, Unified Communications systems, WiFi, Data Centers, Energy Storage, Renewable Energy, and Smart Grid Systems. Page web http://www.intelec.org 11.S3S — 2014 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference Dates 06 Oct 2014 → 09 Oct 2014 [ID=580103] Haut de la page Lieu San Francisco, CA, États-Unis Résumé This new unified conference will help us to improve our efficiency and establish this conference as a world class International venue to present and learn about the most up to date trends in CMOS and post-CMOS Scaling. The conference committee hopes you will enjoy this new conference that will give you more opportunities to learn and gain insight into the different contributions to the low-power SOC eco-system. Page web http://s3sconference.org/ 12.BIOMEIC'14 — Biomedical Engineering International Conference Dates 15 Oct 2014 → 16 Oct 2014 [ID=613355] Haut de la page Lieu Tlemcen, Algérie Résumé The Biomedical Engineering International Conference BIOMEIC’14 will be held from 15-16 October in Tlemcen, Algeria. The aim of BIOMEIC’14 is to provide a convivial environment to scientists, researchers and industrials, in which they can exchange their scientific results. It offers also a convivial space and privileges discussions, meetings between researchers and industrials to present their latest researches on recent topics in different areas of biomedical engineering. Sujets Physiological signal processing, Medical images processing, Biomedical Instrumentation, Biomedical Informatics, Technology of Information and Communication (TIC) in Health-Telemedicine Page web http://www.univ-tlemcen.dz/biomeic14/ Contact BIOMEIC Secretariat, Biomedical Engineering research laboratory, University Aboubekr Belkaid, Tlemcen, Algeria; Tél.: [+213779037753]; Email.: biomeicsecretariat@gmail.com Sujets apparentés Physique appliquée: Biophysique et génie biomédical 13.BTS — IEEE Broadcast Symposium Dates 15 Oct 2014 → 17 Oct 2014 [ID=633083] Haut de la page Lieu San Antonio, États-Unis Page web http://bts.ieee.org/ Sujets apparentés Physique appliquée: Électrostatique et rayonnement électromagnétique 14.AUTOMATION 2014 Dates 15 Oct 2014 → 18 Oct 2014 [ID=590339] Haut de la page Lieu Mumbai, Inde Résumé Automation 2014 showcases a wide and comprehensive range of manufacturing and automation equipments and products which are used by almost all types of industrial sectors. Sujets Factory Automation Process Automation & Control Systems Field Instrumentation & Smart Sensors Robotics & Drives Bus Technologies Software Solutions Wireless Technology Building Automation Hydraulics & Pneumatics Automation in Renewable Energy Safety and Security Systems Page web http://www.iedcommunications.com Contact Benedicta Andrew; Tél.: [91 22 28505138]; Email.: beni@iedcommunications.com Sujets apparentés Robotique, automation & mécatronique; Ingénierie automobile et ferroviaire 15.CSISC — 2014 IEEE Compound Semiconductor Integrated Circuit Symposium Dates 19 Oct 2014 → 22 Oct 2014 [ID=550737] Haut de la page Lieu San Diego, Californie, États-Unis Résumé CSICS is a technology and integrated circuit conference showcasing many of the finest achievements made in compound semiconductor technology and circuits. CSICS has grown to encompass GaAs, InP, GaN, SiGe, SiC, InSb, nano-scale CMOS, and graphene semiconductor technologies and their application to RF, mm-wave, high-speed, and energy conversion circuits and systems. Specific technical areas of interest include: Innovative device concepts in emerging technologies, Nitrides, InP, III-V on Si, Ge on Si, Graphene, Analog, RF, mixed-signal, mm-wave, THz circuit blocks and ICs in III-V, CMOS, SiGe BiCMOS, Power conversion circuits and technologies, Optoelectronic and photonic devices and ICs, System applications, Wireless handsets and base stations, Vehicular and military RADAR, High-speed digital systems, Fiber optics and photonics, Device and circuit modeling / EM and EDA tools, Thermal simulation and advanced packaging of highpower devices and ICs, Device and IC manufacturing processes Page web http://www.csics.org Sujets apparentés Physique de la matière condensée: Semi-conducteurs 16.ITC — 2014 IEEE International Test Conference Dates 20 Oct 2014 → 23 Oct 2014 [ID=573564] Haut de la page Lieu Seattle, WA, États-Unis Résumé ITC is the world's premier conference dedicated to electronic test technology, covering the complete cycle from design verification, test, diagnosis, failure analysis back to process and design improvement. At ITC, test and design professionals can confront the challenges the industry faces and learn how these challenges have been addressed by the combined efforts of academia, design tool and equipment suppliers, designers, and test engineers. Page web http://www.itctestweek.org/ Sujets apparentés Métrologie et instrumentation 17.SAE Convergence Conference & Exhibition Dates 21 Oct 2014 → 22 Oct 2014 [ID=633462] Haut de la page Lieu Detroit, États-Unis Résumé For decades, the SAE Convergence Conference & Exhibition has brought together technology leaders from across the Globe to address the impact of electronics systems and the issues critical to mobility electronics implementation. This year features a compelling line-up focusing on the most relevant issues surrounding electronics technology. Page web http://www.sae.org/events/convergence/ Sujets apparentés Ingénierie automobile et ferroviaire 18.ITC — IEEE International Test Conference Dates 21 Oct 2014 → 23 Oct 2014 [ID=633504] Haut de la page Lieu Seattle, États-Unis Résumé International Test Conference, the cornerstone of TestWeek™ events, is the world’s premier conference dedicated to the electronic test of devices, boards and systems-covering the complete cycle from design verification and validation, test (DFT, ATPG, and BIST), diagnosis, failure analysis and back to process, yield, reliability and design improvement. At ITC, test and design professionals can confront the challenges the industry faces, and learn how these challenges are being addressed by the combined efforts of academia, design tool and equipment suppliers, designers, and test engineers. Page web http://www.itctestweek.org Sujets apparentés Matériel informatique; Ingénierie 19.IMPACT — International Microsystems, Packaging, Assembly and Circuits Technology Conference Dates 22 Oct 2014 → 24 Oct 2014 [ID=633620] Haut de la page Lieu Taipei, Taiwan, Chine Page web http://www.impact.org.tw/2014/General/ Sujets apparentés Matériel informatique 20.EPEPS — 2014 IEEE 23rd Electrical Performance of Electronic Packaging and Systems Dates 26 Oct 2014 → 29 Oct 2014 [ID=572064] Haut de la page Lieu Portland, OR, États-Unis Résumé EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems. It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs. EPEPS is jointly sponsored by the IEEE Components, Packaging and Manufacturing Technology Society and IEEE Microwave Theory and Techniques Society. Page web http://epeps.ece.illinois.edu 21.BIHTEL 2014 — X International Symposium on Telecommunications Dates 27 Oct 2014 → 29 Oct 2014 [ID=617687] Haut de la page Lieu Sarajevo, Bosnie-Herzégovine Résumé X International Symposium on Telecommunications – BIHTEL 2014, organized by Faculty of Electrical Engineering Sarajevo, will be held in Sarajevo, Bosnia and Herzegovina, during October 27-29, 2014. Sujets Communication and Information Theory, Signal Processing for Communications, Wireless and Radio Communications and Networking, Modelling and Simulation, Software-defined Networking and Virtualization, Management in Communication Systems and Networks, Next-Generation Networks, Communications Software Services and Multimedia Applications, Optical Networks, Communication and Information Systems, Security, Education in Communication Engineering, Page web http://bihtel.etf.unsa.ba/bihtel-2014/cms/ Contact Tél.: [+(387) (33)250 734]; Email.: kturbic@etf.unsa.ba Sujets apparentés Informatique mobile & télécommunications 22.ICRAMAV-2014 — International Conference on Recent Advances in Design, Development and Operation of Micro Air Vehicles Dates 05 Nov 2014 → 07 Nov 2014 [ID=637908] Haut de la page Lieu Hyderabad (Telangana), Inde Résumé The Conference primarily focuses on important issues related to guidance, navigation, control, sensors, aerodynamics, system engineering, operations, legal aspects, fuselage & propulsion systems related to Unmanned Air Vehicles. Page web http://icramavjntuh.com/ Contact Dr. M. Madhavi Lath, Director, Innovative Technologies , Jawaharlal Nehru Technological University Hyderabad ; Tél.: [+91 40 23158662,Mobile, +91 9848506611]; Email.: itc@jntuh.ac.in Sujets apparentés Aviation & vol spatial; Robotique, automation & mécatronique 23.IPAS — International Image Processing, Applications and Systems Conference Dates 05 Nov 2014 → 07 Nov 2014 [ID=650015] Haut de la page Lieu Hammamet, Tunisie Résumé The international Image Processing Applications and Systems conference is intended for grouping from all over the world challenging researchers, innovators, academicians, and practitioners in image processing theory and tools, for following high level tutorials, sharing their achievements, exchanging their experiences and discussing future orientations. The conference will also offer an opportunity to make a bridge between image processing researchers and people working in other application fields such as medical doctors, radiotherapists or industrial parts. Sujets Image and Video Processing Theory Image and Video Processing Applications Computer Science and Imaging Real Time Image Processing Page web http://www.ipas-ciels-univ-sfax.com Contact IPAS’14 Organizing committee; Email.: ipas14@ipas-ciels-univ-sfax.com Sujets apparentés Multimédia et infographie; Mathématiques appliquées: Reconnaissance de formes et traitement d'image 24.CENICS 2014 — The Seventh International Conference on Advances in Circuits, Electronics and Micro-electronics Dates 16 Nov 2014 → 20 Nov 2014 [ID=600494] Haut de la page Lieu Lisbonne, Portugal Organisateur International Academy, Research and Industry Association (IARIA) Résumé Colocated with other events part of NetWare 2014 Page web http://www.iaria.org/conferences.html Sujets apparentés Matériel informatique 25.Electricity 2014 — The 15th International Annual Convention of the Society of Electrical and Electronics Engineers in Israel Dates 03 Dec 2014 → 06 Dec 2014 [ID=629165] Haut de la page Lieu Eilat, Israël Résumé This year convention will be focusing, among the traditional topics, also the Penetration of the Smart Grid, the Neutral Gas Revolution and the Electricity Market Reform Plan. Sujets Energy and Cyber Security, Energy Management, Control Systems, Energy Efficiency, Energy Systems in Buildings, Engineering Projects, Industrial Control, Lighting Systems , Operation and Maintenance of Electrical Facilities, Power Electronics, Power Generation Systems, Power Quality and Reliability, Testing, Measuring and Standardization, Trends and Innovations in Facilities and Electrical Systems Page web http://electricity2014.com/ Contact Tamar Orkabi ; Tél.: [972-3-5767716]; Email.: torkabi@paragong.com Sujets apparentés Électrotechnique 26.ISIC — 2014 International Symposium on Integrated Circuits Dates 10 Dec 2014 → 12 Dec 2014 [ID=573451] Haut de la page Lieu Singapore, Singapour Résumé This conference will appeal to reseachers and practitioners of IC design and EDA tools. Page web http://www.isic2014.org Sujets apparentés Physique de la matière condensée: Semi-conducteurs 27.ISSPIT 2014 — 2014 IEEE International Symposium on Signal Processing and Information Technology Dates 15 Dec 2014 → 17 Dec 2014 [ID=635119] Haut de la page Lieu Delhi, Inde Page web http://www.computer.org/portal/web/conferences/calendar Sujets apparentés Evénement multidisciplinaires ou générales en informatique 28.ISED 2014 — 5th International Symposium on Electronic System Design Dates 18 Dec 2014 → 20 Dec 2014 [ID=619035] Haut de la page Lieu Ajmer, Rajasthan, Inde Page web http://www.computer.org/portal/web/conferences/calendar 29.SPACES — 2015 International Conference on Signal Processing And Communication Engineering Systems Dates 02 Jan 2015 → 03 Jan 2015 [ID=635751] Haut de la page Lieu GUNTUR, Inde Résumé "International Conference on Signal Processing And Communication Engineering Systems 2015"will be held in K L University, Vijayawada,India on 2-3 Jan 2015. The aim of the conference is to provide a platform for Students, Engineers, Academicians, Researchers and Scientists who are involved in research in the field of Advanced Signal Processing Applications to contribute and to disseminate the innovative and important new work. The Conference provides a leading forum for sharing original research contributions and practical development experiences among researchers and application developers. The primary goal of the conference is to promote research and developmental activities by understanding what others have achieved successfully in their respective applications and "translocation" those ideas into another field could help speedup what we need to achieve ourselves in our respective domains. Page web http://spaces-2015.webs.com/ 30.ICCE — 2015 IEEE International Conference on Consumer Electronics Dates 09 Jan 2015 → 12 Jan 2015 [ID=635940] Haut de la page Lieu Las Vegas, NV, États-Unis Résumé Key technologies, products, services and architectures for consumer entertainment and information delivery are first seen at ICCE Page web http://www.icce.org 31.RWS — 2015 IEEE Radio and Wireless Symposium Dates 25 Jan 2015 → 28 Jan 2015 [ID=580676] Haut de la page Lieu San Diego, Californie, États-Unis Résumé This is a set of five conferences with a focus on wireless components, applications, and systems that effect both now and our future life style. These conferences main niche is to bring together technologists, circuit designers, system designers, and entrepreneurs at a single event. It was and is the place where these worlds meet, where new processes and systems can be benchmarked against the needs of circuit designers at the bleeding edge of RF systems, where today s design compromises can trigger tomorrow s advanced technologies. Where dreams can become a reality. Page web http://www.radiowirelessweek.org/ Sujets apparentés Informatique mobile & télécommunications 32.PAWR — 2015 IEEE Topical Conference on Power Amplifiers for Wireless and Radio Applications Dates 25 Jan 2015 → 28 Jan 2015 [ID=580708] Haut de la page Lieu San Diego, Californie, États-Unis Résumé Power amplifiers are often the most critical component of RF/microwave communications systems and consequently the focus of intense research to achieve increased linearity and power efficiency. This conference reviews the new forms of power amplification that are being developed to meet the needs of the wireless communication equipment industry and the world s demand for greater information transmission. Page web http://www.radiowirelessweek.org/pawr/ Sujets apparentés Informatique mobile & télécommunications 33.SiRF — 2015 IEEE 15th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems Dates 25 Jan 2015 → 28 Jan 2015 [ID=585776] Haut de la page Lieu San Diego, Californie, États-Unis Résumé Silicon-based devices, passives, integrated circuits, and applications for high frequency systems. Page web http://www.silicon-rf.org/sirf2015 Sujets apparentés Physique de la matière condensée: Semi-conducteurs 34.EDCAV — 2015 International Conference on Electronic Design, Computer Networks & Automated Verification Dates 29 Jan 2015 → 30 Jan 2015 [ID=635902] Haut de la page Lieu Shillong, Inde Résumé The aim of the conference is to provide a platform for engineers to disseminate and discuss their current research findings and also to explore recent development, current practices and future trends in Electronics, Communications and Computers. We also encourage the dissemination of R&D linked to the Industry. The conference program includes sessions with invited speakers and breakout sessions with oral, poster and demo presentations in the fields of Electronics, Communications and Computers. Page web http://www.edcav.org Sujets apparentés Matériel informatique 35.EI15 — IS&T / SPIE Electronic Imaging 2015 Dates 08 Fév 2015 → 12 Fév 2015 [ID=625396] Haut de la page Lieu San Francisco, États-Unis Résumé IS&T/ SPIE Electronic Imaging is the best global audience for digital imaging systems, 3D imaging, image quality, and image processing. It is the must attend event for all aspects of electronic imaging, from imaging systems to instrumentation to image processing to algorithms. Topics include digital imaging, sensors and applications, 3D Imaging, multimedia, image processing, visualization and perception, and visual communications. Oral and interactive paper presentations are encouraged on CCD, CMOS sensors, digital photography, color hardcopy, human vision, image processing and compression, stereoscopic displays, image quality, and multimedia imaging systems. Sujets 3d imaging processing, stereoscopic displays, video surveillance, color imaging, video processing, computational imaging, image sensors, image systems, mobile devices and multimedia Page web http://electronicimaging.org/?WT.mc_id=REICAW Contact Customer Service ; Tél.: [(360) 676-3290]; Email.: customerservice@spie.org Sujets apparentés Mathématiques appliquées: Reconnaissance de formes et traitement d'image; Opto-électronique et technique d'affichage 36.ISSCC — 2015 IEEE International Solid- State Circuits Conference Dates 22 Fév 2015 → 26 Fév 2015 [ID=573522] Haut de la page Lieu San Francisco, CA, États-Unis Résumé foremost forum for presentation of advances in solid-state circuits and systems-on-a-chip. The Conference offers a unique opportunity for engineers working at the cutting edge of IC design and use to maintain technical currency, and to network with leading experts. Page web http://www.isscc.org/isscc/futureisscc.htm Sujets apparentés Physique de la matière condensée: Semi-conducteurs 37.APEC — 2015 IEEE Applied Power Electronics Conference and Exposition Dates 15 Mar 2015 → 19 Mar 2015 [ID=572575] Haut de la page Lieu Charlotte, NC, États-Unis Résumé APEC focuses on the practical and applied aspects of the power electronics business for equipment OEMs, component manufacturers and designers of power supplies, dc-dc converters, motor drives, UPSs, solar, renewable energy, inverters and any other power electronic circuits, equipments and systems. Page web http://www.apec-conf.org/ 38.ICIT 2015 — 2015 IEEE International Conference on Industrial Technology Dates 17 Mar 2015 → 19 Mar 2015 [ID=622138] Haut de la page Lieu Séville, Espagne Résumé IEEE ICIT is one of the flagship yearly conferences of the IEEE Industrial Electronics Society, devoted to the dissemination of new ideas, research and works in progress within the fields of intelligent and computer control systems, robotics, factory communications and automation, flexible manufacturing, data acquisition and signal processing, vision systems, and power electronics. IEEE ICIT 2015 will be held in Seville, Spain, from March 17th to 19th, 2015. Seville is well connected to the world by an international airport, a high speed train, four motorways, and a river port, and contains the longest bycicle track system in Europe. Touristic attractions include historic district with the gothic Cathedral and the Arabic Palace Alcazar, Baroque churches, a theme park, river cruises, and nearby National Parks and beaches. Seville combines a rich historical past, when it was the main gate to Europe from the Americas, with a vibrant present as a technological center and meeting point. Sujets Control Systems, Robotics and Mechatronics Power Electronics and Renewable Energy Conversion Power Systems and the Smart Grid Sensors, Actuators and Micro-nanotechnology Signal Processing and Computational Intelligence Electronic System on Chip and Embedded Control Electrical Machines and Drives Industrial Automation, Communication and Informatics Education and E-Learning in Electronics Page web http://www.icit2015.org Contact Antonio Luque; Tél.: [+34954481297]; Email.: aluque@ieee.org Sujets apparentés Électrotechnique; Robotique, automation & mécatronique 39.ISISS — 2015 IEEE International Symposium on Inertial Sensors and Systems Dates 23 Mar 2015 → 26 Mar 2015 [ID=636105] Haut de la page Lieu Waimea, HI, États-Unis Résumé The IEEE ISISS has an ambition to establish itself as the premier forum for reporting the latest research, development, and commercialization results in modern Inertial Sensors and Systems. Talks on materials and micro-fabrication processes, innovative designs, and new physical principals will be held, and there will be a growing number of new applications and business opportunities. Page web http://www.ieee-isiss.org Sujets apparentés Métrologie et instrumentation; Microtechnologie, nanotechnologie 40.ICMTS — 2015 International Conference on Microelectronic Test Structures Dates 23 Mar 2015 → 26 Mar 2015 [ID=636384] Haut de la page Lieu Tempe, AZ, États-Unis Résumé The Conference presents new developments in test structures, their implementation, and/or application in the fields of silicon, compound semiconductor, nanotechnology, and MEMS research, including their implementation and applications, as well as test structures aimed at the characterization of new materials and devices. Page web http://www.see.ed.ac.uk/ICMTS Sujets apparentés Physique de la matière condensée: Semi-conducteurs 41.IWS — 2015 IEEE International Wireless Symposium Dates 30 Mar 2015 → 01 Avr 2015 [ID=636220] Haut de la page Lieu Shenzhen, Chine Résumé The Third IEEE MTT-S International Wireless Symposium (IWS 2015) will be held 30 March – 1 April 2015 in Shenzhen, China. This conference is held annually in China to provide an international forum for the presentation and exchange of the latest technical achievements in microwave circuits and hardware and RF systems related to the physical layer aspects of the existing and emerging wireless systems including but not limited to RFID, UWB, 802.15.4, WiGig, ZigBee, 6LoWPAN, Wireless HART, WiMi, WISA, Bluetooth, MIMO, WiMax, 5G and others. IWS 2015 will feature parallel session tracks, workshops and short courses, and technology exhibition showcasing the latest wireless commercial products. Page web http://www.iws-ieee.org 42.WAMICON — 2015 IEEE 16th Annual Wireless and Microwave Technology Conference Dates 12 Avr 2015 → 15 Avr 2015 [ID=636499] Haut de la page Lieu Cocoa Beach, FL, États-Unis Résumé The conference addresses up-to-date multidisciplinary research needs and interdisciplinary aspects of wireless and RF technologies. Content includes cognitive radio, 5G and advanced data networks, UWB, MIMO, power amplifiers and modeling, point-to-point and point-to-multipoint systems. Page web http://www.wamicon.org Sujets apparentés Informatique mobile & télécommunications 43.SPIE Optics + Optoelectronics 2015 Dates 13 Avr 2015 → 16 Avr 2015 [ID=639467] Haut de la page Lieu Prague, République tchèque Résumé SPIE Optics + Optoelectronics is a meeting that highlights the technologies that drive Europe’s largest optoelectronic infrastructure projects, such as HiPER, HiLASE, ELI Beamlines, plus conferences and workshops on laser acceleration, FELs, X-ray and EUV optics, nonlinear optics, and more. Sujets Metamaterials, Nonlinear Optics and Applications, Photon Counting Applications, Quantum Optics and Quantum Information Transfer and Processing, Optical Sensors, Micro-structured and Specialty Optical Fibres, Holography: Advances in Classical Holography and Modern Trends, Harnessing Relativistic Plasma Waves as Novel Radiation Sources from Terahertz to X-rays , EUV and X-ray Optics: Synergy between Laboratory and Space, Damage to VUV, EUV, and X-ray Optic, Advances in X-ray Free-Electron Laser Instrumentation, High-Power, High-Energy, and High-Intensity Laser Technology, Medical Applications of Laser Generated Beams of Particles, Laser Acceleration of Electrons, Protons and Ions, Research Using Extreme Light: Entering New Frontiers with PW-Class Lasers, Laser Energy Workshop, Integrated Optics: Physics and Simulations Page web http://spie.org/optics-optoelectronics.xml?WT.mc_id=REOOCAW Contact SPIE Europe ; Tél.: [+44 29 2089 4747]; Email.: info@spieeurope.org Sujets apparentés Optique et lasers; Opto-électronique et technique d'affichage 44.ICNS — 2015 Integrated Communication, Navigation, and Surveillance Conference Dates 19 Avr 2015 → 24 Avr 2015 [ID=579930] Haut de la page Lieu Herdon, VA, États-Unis Résumé New reserach, development and implementation programs and policies related to ICNS data link communications, ADS-B, SWIM, airport surface communications, spectrum constraints, transition to digital communications, surveillance systems integration, satellite-based navigation, integration, avionics equipage, secure airborne networking, unmanned aircraft integration into the airspace, NextGen, SESAR, and new commercial aircraft integration and operation, airspace management. Page web http://i-cns.org | |
| | | albatross
Messages : 1618 Points : 4124
| Sujet: Re: Liste des Conférences - Électronique 2014 2015 Sam 13 Sep 2014 - 7:38 | |
| IVEC — 2015 IEEE International Vacuum Electronics Conference Dates 27 Avr 2015 → 29 Avr 2015 [ID=635452] Haut de la page Lieu Pékin, Chine Résumé IVEC was originally created in 2000 and has now expanded to a fully international conference for vacuum electronic device and system professionals. IVEC2015 is organized by IEEE Beijing Section, Beijing Vacuum Electronics Research Institute and National Key Laboratory of Science and Technology on Vacuum Electronics. It will commence with an inaugural and plenary sessions including talks by eminent experts to focus onto the history, the broad spectrum of fundamental physics, the scientific issues, and the technological applications driving the current and future directions in vacuum electronics research. Subsequently, a number of parallel oral and poster sessions will range from the fundamental physics of electron emission and modulated electron beams to the design and operation of devices at UHF to THz frequencies, present latest developments in theories and computational design tools, active and passive components, systems, and supporting technologies. Page web http://cie-china.org/ivec2015 46.VLSI-DAT — 2015 International Symposium on VLSI Design, Automation and Test Dates 27 Avr 2015 → 29 Avr 2015 [ID=635761] Haut de la page Lieu Hsinchu, Taïwan Résumé RF, analog and mixed-signal circuits Sensors and interface circuits Digital circuits and ASIC CPU, DSP and multicore architectures Memory circuits and systems Low power logic and architectures Multimedia processing circuits Communication circuits Embedded systems and software Designs using novel technologies System-in-package design Electronic System Level Design Modeling and simulation Hardware-software co-design Logic and architecture synthesis Page web http://vlsidat.itri.org.tw/ Sujets apparentés Matériel informatique 47.CCECE — 2015 IEEE 28th Canadian Conference on Electrical and Computer Engineering Dates 03 Mai 2015 → 06 Mai 2015 [ID=573080] Haut de la page Lieu Halifax, NS, Canada Page web http://www.ieee.ca/ccece15 Sujets apparentés Evénement multidisciplinaires ou générales en informatique 48.ISNE — 2015 International Symposium on Next-Generation Electronics Dates 04 Mai 2015 → 06 Mai 2015 [ID=635601] Haut de la page Lieu Taipei, Taïwan Résumé The 4th ISNE conference welcomes scientific papers in the field of Computer systems and applications, Processor design, Computer networks, Electronic design automation, Multimedia systems and applications, Education in computer science and engineering, Sensor systems, Communication systems, Power electronics, Biomedical circuits and systems, Image processing, IC & IC Packaging, Photovoltaic, materials, devices and systems, Nanomaterials, Micro/Nanofabrication, Semiconductor lasers and LEDs, Photonic and optical devices, Display technology, Fiber optics and fiber sensing, Photonic communications, and Solid state lighting technology. Page web http://isne2015.ntust.edu.tw 49.ISPSD — 2015 IEEE 27th International Symposium on Power Semiconductor Devices & IC's Dates 10 Mai 2015 → 14 Mai 2015 [ID=636279] Haut de la page Lieu Hong Kong, Chine Résumé Power electronics Page web http://www.ispsd2015.com Sujets apparentés Physique de la matière condensée: Semi-conducteurs 50.ISCAS — 2015 IEEE International Symposium on Circuits and Systems Dates 24 Mai 2015 → 27 Mai 2015 [ID=636259] Haut de la page Lieu Lisbonne, Portugal Résumé The IEEE International Symposium on Circuits and Systems (ISCAS) is the flagship conference of the IEEE Circuits and Systems Society and the world's premier networking forum in the highly active fields of theory, design and implementation of circuits and systems. ISCAS 2015 will have a special focus on Enabling Technologies for Societal Challenges, and seeks to address multidisciplinary challenges as circuits and systems using microelectronics, nanotechnologies and biotechnologies to address health, demographic change, wellbeing, security and sustainability issues. Page web http://www.iscas2015.org 51.APEMC — 2015 Asia-Pacific Symposium on Electromagnetic Compatibility Dates 26 Mai 2015 → 29 Mai 2015 [ID=635866] Haut de la page Lieu Taipei, Taïwan Résumé The symposium aims to share recent advances in all aspects of EMC in the Asia-Pacific region, to respond the EMC requirements for all rising technologies, and to closely link up the international EMC community. The symposium will cover the entire scope of EMC; especially, it will offer a rich technical program of highest quality, lectures presented by distinguished speakers from all over the world, and a broad forum for interacting between academia and industry. Page web http://www.apemc2015.org 52.ECTC — 2015 IEEE 65th Electronic Components and Technology Conference Dates 02 Jui 2015 → 05 Jui 2015 [ID=572817] Haut de la page Lieu San Diego, Californie, États-Unis Résumé ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society. ECTC papers comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation. Page web http://www.ectc.net 53.WoW — 2015 IEEE PELS Workshop on Emerging Technologies: Wireless Power Dates 05 Jui 2015 → 06 Jui 2015 [ID=635781] Haut de la page Lieu Daejeon, Corée du Sud Résumé Wireless powers for mobile devices (smart phones, tablet PC, etc.) Wireless powers for electric vehicles (PHEV, BEV, RPEV; bus, train, etc.) Wireless powers for home appliances Wireless powers for industry applications Wireless powers for medical and defense applications Converters for wireless powers Analytical methods for wireless powers Environmental impacts of wireless powers Magnetics and coil designs for wireless powers Components and EMC designs for wireless powers Modeling, simulation, and control of wireless power systems Page web http://www.2015wow.org/ 54.DAC — 2015 52nd ACM/EDAC/IEEE Design Automation Conference Dates 08 Jui 2015 → 12 Jui 2015 [ID=572661] Haut de la page Lieu San Francisco, CA, États-Unis Résumé The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities. Page web http://www.dac.com 55.2015 IEEE 11th International Conference on Power Electronics and Drive Systems Dates 09 Jui 2015 → 12 Jui 2015 [ID=573284] Haut de la page Lieu Sydney, Australie Résumé The conference opens up an opportunity for academics and industrial professionals worldwide to exchange their knowledge of the state-of-the-art power electronics and drive technologies and applications. The programme will feature on tutorials and technical paper presentations. The range of technical topics includes but not limited to: Power semiconductors, Power integrated circuits (PIC), passive components and packaging technologies Motor drives and motion control Analysis and design of electrical machines Hard-switching and soft-switching static power converters and UPS Applications of power electronics in power system and generation/FACTS Power quality issues, harmonic problems and solutions EMI/EMC issues Traction and automotive systems Applications of power electronics in home appliance, industry and aerospace Renewable energy technologies Distributed generation and smart-grid Modelling and simulation in power electronics Page web http://www.ieee-peds.org Sujets apparentés Électrotechnique 56.BMSB — 2015 IEEE International Symposium on Broadband Multimedia Systems and Broadcasting Dates 17 Jui 2015 → 19 Jui 2015 [ID=636465] Haut de la page Lieu Gand, Belgique Résumé The presentation and exchange of technical advances in the rapidly converging areas of multimedia broadcasting, telecommunications, consumer electronics, and networking technologies Page web http://www.wica.intec.ugent.be/bmsb2015/ Sujets apparentés Informatique mobile & télécommunications 57.CPE — 2015 9th International Conference on Compatibility and Power Electronics Dates 24 Jui 2015 → 26 Jui 2015 [ID=635763] Haut de la page Lieu Caparica, Portugal Résumé In the field of electrical engineering, power electronics is being dynamically developed, finding its application in several industrial branches. Many production technologies became more efficient, when applying power electronics equipment. Power electronics and energy systems integration provide high standards of human friendly environment. The next generation of power electronics systems must change environmental factors, customer concerns and reliability. International Conference on Compatibility and Power Electronics is an international wide forum for researchers, practitioners and postgraduate students to exchange new ideas and experiences in the area of power electronics application to different systems. The first conference of the International Conference-Workshop on Compatibility and Power Electronics series was first held in 1999. From its beginning the objective of CPE has been to offer a wide forum of discussion to power electronics specialists. Page web http://sites.uninova.pt/cpe2015 Sujets apparentés Électrotechnique 58.IMWS-AMP — 2015 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications Dates 01 Jul 2015 → 03 Jul 2015 [ID=636336] Haut de la page Lieu Suzhou, Chine Résumé Carbon nanotubes and 2D electronic and optoelectronic devices (e.g. graphene and beyond graphene- Wide bandgap and other emerging semiconductor materials (e.g. ionic)-pin-wave and magnonic crystal materials â-gineered metamaterials and plasmonics for absorption, cloaking, and wave manipulation- Ferromagnetic materials and superconducting materia-Advanced silicon, integrated passive devices (IPD) and through silicon via (TSV) Ã-CC, LCP, large area printing and inkjet printing -3D printing - Passive/active microwave and terahertz devices (material characterization, fabrications, and applications)- Antennas with advanced/complex/artificial materials and processes Page web http://www.nusri.cn/imws-amp2015 59.EMC 2015 — 2015 IEEE International Symposium on Electromagnetic Compatibility Dates 16 Aou 2015 → 22 Aou 2015 [ID=572865] Haut de la page Lieu Dresden, Allemagne Résumé The EMC 2015 provides an excellent forum for presentation, discussion and exchange of the latest EMC problems and solutions from universities, research laboratories and industry. Page web http://www.emc2015.org 60.EPE ECCE-Europe — 2015 IEEE 17th European Conference on Power Electronics and Applications Dates 07 Sep 2015 → 11 Sep 2015 [ID=635912] Haut de la page Lieu Genève, Suisse Résumé Energy conversion and conditioning technologies, power electronics, adjustable speed drives and their applications, power electronics for the smarter grid, energy efficiency, technologies for sustainable energy systems, converters and power supplies Page web http://www.epe2015.com 61.ITC — 2015 IEEE International Test Conference Dates 06 Oct 2015 → 08 Oct 2015 [ID=635632] Haut de la page Lieu Anaheim, CA, États-Unis Résumé International Test Conference, the cornerstone of TestWeek events, is the world's premier conference dedicated to the electronic test of devices, boards and systems-covering the complete cycle from design verification, test, diagnosis, failure analysis and back to process and design improvement. At ITC, test and design professionals can confront the challenges the industry faces, and learn how these challenges are being addressed by the combined efforts of academia, design tool and equipment suppliers, designers, and test engineers. Page web http://itctestweek.org 62.CSICS — 2015 IEEE Compound Semiconductor Integrated Circuit Symposium Dates 11 Oct 2015 → 14 Oct 2015 [ID=635860] Haut de la page Lieu New Orleans, LA, États-Unis Résumé CSICS is a technology and integrated circuit conference showcasing many of the finest achievements made in compound semiconductor technology and circuits. CSICS has grown to encompass GaAs, InP, GaN, SiGe, SiC, InSb, nano-scale CMOS, and graphene semiconductor technologies and their application to RF, mm-wave, high-speed, and energy conversion circuits and systems. Specific technical areas of interest include: Innovative device concepts in emerging technologies, Nitrides, InP, III-V on Si, Ge on Si, Graphene, Analog, RF, mixed-signal, mm-wave, THz circuit blocks and ICs in III-V, CMOS, SiGe BiCMOS, Power conversion circuits and technologies, Optoelectronic and photonic devices and ICs, System applications, Wireless handsets and base stations, Vehicular and military RADAR, High-speed digital systems, Fiber optics and photonics, Device and circuit modeling / EM and EDA tools, Thermal simulation and advanced packaging of high power devices and ICs, Device and IC manufacturing processes. Page web http://www.csics.org Sujets apparentés Matériel informatique; Physique de la matière condensée: Semi-conducteurs 63.Holm 2015 — 2015 IEEE 61st Holm Conference on Electrical Contacts Dates 11 Oct 2015 → 14 Oct 2015 [ID=635932] Haut de la page Lieu San Diego, Californie, États-Unis Résumé Practicing designers, engineers, physicists and research scientists - those new to the field and those experienced. The 2011 Conference will include excellent papers authored by some of the outstanding technical people in this field. The international contributors come from universities and industries in USA, Austria, Canada, Japan, China, France, Switzerland, Russia, Germany, United Kingdom and other countries. These papers will provide the attendees with up-to-date information on a wide range of subjects that makes this conference so attractive to the practicing engineer. Additionally, the joint conference will make it possible for any attendee to discuss with other international authors, on work presented by the author at the conference or any subject related to the author s field of expertise. Page web http://www.ewh.ieee.org/soc/cpmt/tc1/h2011/h2011intro.html Sujets apparentés Physique de la matière condensée et des matériaux; Électrotechnique 64.JIEEEC — 2015 9th Jordanian International Electrical and Electronics Engineering Conference Dates 12 Oct 2015 → 14 Oct 2015 [ID=636252] Haut de la page Lieu Amman, Jordanie Résumé JIEEEC is the ninth in series of annual conferences Page web http://www.jeaconf.org/jieeec Sujets apparentés Électrotechnique 65.IEDM — 2015 IEEE International Electron Devices Meeting Dates 07 Dec 2015 → 09 Dec 2015 [ID=487241] Haut de la page Lieu Washington, DC, États-Unis Résumé IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart-power technologies, etc. Page web http://www.ieee-iedm.org 66.ISSCC — 2016 IEEE International Solid- State Circuits Conference Dates 31 Jan 2016 → 04 Fév 2016 [ID=573532] Haut de la page Lieu San Francisco, CA, États-Unis Résumé foremost forum for presentation of advances in solid-state circuits and systems-on-a-chip. The Conference offers a unique opportunity for engineers working at the cutting edge of IC design and use to maintain technical currency, and to network with leading experts. Page web http://www.isscc.org/isscc/futureisscc.htm Sujets apparentés Physique de la matière condensée: Semi-conducteurs 67.APEC — 2016 IEEE Applied Power Electronics Conference and Exposition Dates 19 Mar 2016 → 24 Mar 2016 [ID=573961] Haut de la page Lieu Long Beach, CA, États-Unis Résumé APEC focuses on the practical and applied aspects of the power electronics business. The conference addresses issues of immediate and long term importance to the practicing power electronics engineer. Page web http://www-apec.conf.org Sujets apparentés Électrotechnique 68.MTT 2016 — 2016 IEEE/MTT-S International Microwave Symposium Dates 22 Mai 2016 → 27 Mai 2016 [ID=573380] Haut de la page Lieu San Francisco, CA, États-Unis Résumé The IEEE International Microwave Symposium (IMS) is the world s foremost conference covering the UHF, RF, wireless, microwave, millimeter-wave, terahertz, and optical frequencies; encompassing everything from basic technologies to components to systems including the latest RFIC, MIC, MEMS and filter technologies, advances in CAD, modeling, EM simulation and more. The IMS includes technical and interactive sessions, exhibits, student competitions, panels, workshops, tutorials, and networking events. Page web http://www.ims2016.org Sujets apparentés Physique appliquée: Électrostatique et rayonnement électromagnétique 69.ISSCC — 2017 IEEE International Solid- State Circuits Conference Dates 05 Fév 2017 → 09 Fév 2017 [ID=573471] Haut de la page Lieu San Francisco, CA, États-Unis Résumé The International Solid-State Circuits Conference is the foremost global forum for solid-state circuits and systems-on-a-chip. The Conference offers 5 days of technical papers and educational events related to integrated circuits, including analog, digital, data converters, memory, RF, communications, imagers, medical and MEMS IC's. Page web http://www.isscc.org Sujets apparentés Physique de la matière condensée: Semi-conducteurs 70.DAC — 2017 54th ACM/EDAC/IEEE Design Automation Conference Dates 19 Jui 2017 → 23 Jui 2017 [ID=572704] Haut de la page Lieu San Francisco, CA, États-Unis Résumé The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities. Page web http://www.dac.com 71.IEDM — 2017 IEEE International Electron Devices Meeting Dates 04 Dec 2017 → 06 Dec 2017 [ID=520737] Haut de la page Lieu San Francisco, CA, États-Unis Résumé the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc. Page web http://www.ieee-iedm.org 72.ISSCC — 2018 IEEE International Solid- State Circuits Conference Dates 04 Fév 2018 → 08 Fév 2018 [ID=573470] Haut de la page Lieu San Francisco, CA, États-Unis Résumé ISSCC is the foremost global forum for solid-state circuits and systems-on-a-chip. The Conference offers 5 days of technical papers and educational events related to integrated circuits, including analog, digital, data converters, memory, RF, communications, imagers, medical and MEMS ICs Page web http://www.isscc.org Sujets apparentés Physique de la matière condensée: Semi-conducteurs 73.ECTC — 2018 IEEE 68th Electronic Components and Technologies Conference Dates 29 Mai 2018 → 01 Jui 2018 [ID=572805] Haut de la page Lieu San Diego, Californie, États-Unis Résumé ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society. ECTC papers comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation Page web http://www.ectc.net 74.DAC — 2018 55th ACM/EDAC/IEEE Design Automation Conference Dates 04 Jui 2018 → 08 Jui 2018 [ID=572692] Haut de la page Lieu San Francisco, CA, États-Unis Résumé The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities. Page web http://www.dac.com 75.ISSCC — 2019 IEEE International Solid- State Circuits Conference Dates 02 Fév 2019 → 06 Fév 2019 [ID=573513] Haut de la page Lieu San Francisco, CA, États-Unis Résumé ISSCC is the foremost global forum for solid-state circuits and systems-on-a-chip. The Conference offers 5 days of technical papers and educational events related to integrated circuits, including analog, digital, data converters, memory, RF, communications, imagers, medical and MEMS ICs. Page web http://www.isscc.org Sujets apparentés Physique de la matière condensée: Semi-conducteurs 76.IEDM — 2019 IEEE International Electron Devices Meeting Dates 09 Dec 2019 → 11 Dec 2019 [ID=520714] Haut de la page Lieu San Francisco, CA, États-Unis Résumé the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc. Page web http://www.ieee-iedm.org 77.ISSCC — 2020 IEEE International Solid- State Circuits Conference Dates 02 Fév 2020 → 06 Fév 2020 [ID=573578] Haut de la page Lieu San Francisco, CA, États-Unis Résumé ISSCC is the foremost global forum for solid-state circuits and systems-on-a-chip. The Conference offers 5 days of technical papers and educational events related to integrated circuits, including analog, digital, data converters, memory, RF, communications, imagers, medical and MEMS ICs. Page web http://www.isscc.org Sujets apparentés Physique de la matière condensée: Semi-conducteurs 78.ECTC — 2020 IEEE 70th Electronic Components and Technology Conference Dates 26 Mai 2020 → 29 Mai 2020 [ID=572859] Haut de la page Lieu Orlando, FL, États-Unis Résumé ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation. Page web http://www.ectc.net 79.DAC — 2020 57th ACM/EDAC/IEEE Design Automation Conference Dates 01 Jui 2020 → 05 Jui 2020 [ID=572724] Haut de la page Lieu San Francisco, CA, États-Unis Résumé The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities. Page web http://www.dac.com 80.ECTC — 2021 IEEE 71st Electronic Components and Technologies Conference Dates 01 Jui 2021 → 04 Jui 2021 [ID=572781] Haut de la page Lieu San Diego, Californie, États-Unis Résumé ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society. ECTC papers comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation. Page web http://www.ectc.net 81.DAC — 2021 58th ACM/EDAC/IEEE Design Automation Conference Dates 07 Jui 2021 → 11 Jui 2021 [ID=572778] Haut de la page Lieu San Francisco, CA, États-Unis Résumé The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities. Page web http://www.dac.com 82.IEDM — 2021 IEEE International Electron Devices Meeting Dates 13 Dec 2021 → 15 Dec 2021 [ID=520735] Haut de la page Lieu San Francisco, CA, États-Unis Résumé the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc. Page web http://www.ieee-iedm.org 83.DAC — 2022 59th ACM/EDAC/IEEE Design Automation Conference Dates 06 Jui 2022 → 10 Jui 2022 [ID=572733] Haut de la page Lieu San Francisco, CA, États-Unis Résumé The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities. Page web http://www.dac.com | |
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